Our Technology & Lab Capabilities
At reverse.parts, we leverage a suite of advanced tools and methodologies to perform in-depth analysis. Our state-of-the-art lab is equipped to handle a wide range of electronic and electro-mechanical products.
Advanced Imaging
High-resolution optical microscopy, Scanning Electron Microscopy (SEM), X-ray imaging (2D and 3D CT scanning) for non-destructive analysis and die inspection.
Electronics Analysis
Schematic reconstruction, PCB layer delamination, signal tracing, component identification, firmware extraction and analysis, logic analyzers, oscilloscopes.
Material & Chemical Analysis
Techniques for IC decapsulation, cross-sectioning, dye penetrant testing, and basic material identification to understand construction and potential failure points.
Software & Data Extraction
Tools for firmware dumping, binary analysis, data recovery from memory chips, and protocol analysis for embedded systems.
Our commitment to investing in the latest technology ensures we can tackle complex reverse engineering challenges and provide you with accurate, actionable intelligence.